1～5 item / All 5 items
Used as a backing plate, alloy material with hardness ≧ 1/2H!
■ Purity > 98.0% ■ Density (8.9 g/cm³) ■ Manufacturing method: Vacuum melting method * For more details, please download the PDF or feel free to contact us.
Used as a backing plate, alloy material with hardness ≧ 1/2H!
■ Purity: 99.97% ■ Density (8.9 g/cm³) ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.
It is a backing plate used in a film-forming device.
This is a backing plate manufactured from C1020 (oxygen-free copper) for use in semiconductor equipment deposition systems. The shape has been formed using a milling machine, with some parts processed on a machining center. Due to the pocket machining and the resulting thin remaining plate thickness, this product is prone to warping and distortion; however, we have processed it to ensure that both flatness and planarity are within 0.1mm. In general, when processing copper, it is particularly noted that corners and similar areas are prone to scratches and dents during deburring. Therefore, at Copper Plate Processing.com, we carry out chamfering on thin areas using a machining center to ensure a tight fit during assembly. As such, processing copper often comes with unique challenges that require individual solutions. If you wish to process copper, please contact Copper Plate Processing.com. We will propose appropriate processing and treatment solutions.
We perform one-stop machining from full circumference cutting, end face machining, to surrounding hole drilling using a complex NC lathe, all programmed.
This is a backing plate for film deposition equipment. The material is C1020 (oxygen-free copper), and it is a copper plate that is difficult to process. This backing plate is processed in a one-stop manner, from full circumference cutting to end face processing and surrounding hole drilling, using the composite NC lathe at Copper Plate Processing.com. As a result, the positional accuracy of the holes is high, enabling the manufacture of backing plates with high shape accuracy. Many companies outsource surface treatment and other processes, but in this case, all processes, including end face processing and hole drilling, were carried out within Copper Plate Processing.com. Additionally, by assembling the program at the beginning, we were able to shorten the processing time. Aject Co., Ltd., which operates Copper Plate Processing.com, has accumulated a track record of processing high-precision parts such as backing plates and vacuum flanges since its establishment in 1968. Even for copper plate parts that other companies may refuse, we can accommodate them thanks to our copper processing technology and management know-how for copper parts. If you are having trouble with copper plate processing, please contact Copper Plate Processing.com first.
This is a backing plate that combines stainless steel (SUS304) and oxygen-free copper (C1020) through welding.
This is a backing plate that combines stainless steel (SUS304) and oxygen-free copper (C1020) through welding. Since stainless steel (SUS304) and oxygen-free copper (C1020) are dissimilar metals, they have different thermal conductivities, making them difficult to process together. Therefore, we used a special processing method to ensure that the welding bonds not only the surface but also the inner surfaces in contact. Additionally, the overall structure adopts a jacket structure with water channels. This example is a backing plate used in the thin film technology of hard disks, and backing plates like this are one of our specialties. We have also produced many research and development products for research institutions such as universities, in addition to the semiconductor and medical fields. Furthermore, we can provide suggestions from the drawing creation and design stage. If you require a backing plate, please feel free to contact us before creating the drawings.
